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INTEGRATED CIRCUITS
DATA SHEET
PCF1303T 18-element bar graph LCD driver
Product specification File under Integrated Circuits, IC01 November 1986
Philips Semiconductors
Product specification
18-element bar graph LCD driver
GENERAL DESCRIPTION
PCF1303T
The PCF1303T is an 18-element bar graph LCD driver with linear relation to control voltage (Vc) when in pointer or thermometer mode.
Fig.1 Block diagram.
PACKAGE OUTLINE PCF1303T: 28-lead mini-pack; plastic (SO28; SOT136A); SOT136-1; 1996 September 02.
November 1986
2
Philips Semiconductors
Product specification
18-element bar graph LCD driver
PIN DESCRIPTION PIN NO. 1 4 5 6 to 23 24 25 26 27 28 SYMBOL Vosc I1 VSS Q1 to Q18 QR Vc Vref min Vref max VDD positive supply voltage NAME AND FUNCTION oscillator pin mode select input ground (0 V) segment outputs back-plane output control voltage reference voltage inputs
PCF1303T
FUNCTION TABLE I1 L H H = HIGH voltage level L = LOW voltage level pointer thermometer MODE
(1) Pins 2 and 3 should be connected to VSS.
Fig.2 Pin configuration.
November 1986
3
Philips Semiconductors
Product specification
18-element bar graph LCD driver
FUNCTIONAL DESCRIPTION
PCF1303T
The PCF1303T is an 18-element bar graph LCD driver with linear relation to the control voltage when in pointer or thermometer mode. The first segment will energize when the control voltage is less than the trigger voltage (VT(bar)2 see equation (3)). The circuit has analogue and digital sections. The analogue section consists of a comparator with the inverting input coupled to the input control voltage. The non-inverting input of the comparator is connected via 17 analogue switches to the nodes of an 18-element resistor divider. The extremities of the resistor divider are coupled via high-input impedance amplifiers to the maximum reference voltage input and the minimum reference voltage input. The control input functions with Schmitt trigger action. The digital section has one reference output (QR) to drive the back-plane and 18 outputs (Q1 to Q18) to drive the segments. The segment outputs incorporate two latches and some gates. The circuit is driven by an on-chip oscillator with external resistors and capacitors. The outputs are driven at typical 100 Hz. LINEARITY V step = V step V step Vstep is the voltage drop (internal) across the resistor-ladder network. Vstep is the differential on Vstep. ( V ref max V 2 ) - ( V ref min V 2 ) V step = -------------------------------------------------------------------------------------------18 V2 and V2 are the maximum offset voltage spread of the on-chip voltage followers. ABSOLUTE VOLTAGE TRIGGER LEVEL The absolute voltage trigger level at the Vc pin is VT(bar)n; V T ( bar ) n = ( V ref min V 2 ) + { ( n - 1 ) V step V R } V 1 V H n = number of segments; 2 n 18. VR is the voltage deviation at step n of the resistor-ladder network (for n = 2 or 18, VR = Vstep). V1 is the offset voltage for the on-chip comparator. VH is the hysteresis voltage: 30% Vstep VH 10% Vstep. Note to equation (3) For V2 the same sign (+ or -) should be used as in equation (2). (3)
(1)
(2)
November 1986
4
Philips Semiconductors
Product specification
18-element bar graph LCD driver
RATINGS Limiting values as in accordance with the Absolute Maximum System (IEC 134) Supply voltage Voltage on any input D.C. current into any input or output Storage temperature range Operating ambient temperature range D.C. CHARACTERISTICS VSS = 0 V Tamb (C) PARAMETER VDD V Quiescent device current Operating supply current Input leakage current HIGH level input voltage select input I1 LOW level input voltage select input I1 HIGH level output voltage LOW level output voltage Output current HIGH Output current LOW 6,0 8,2 10,0 6,0 8,2 10,0 6,0 8,2 10,0 6,0 8,2 10,0 6,0 8,2 10,0 6,0 8,2 10,0 6,0 8,2 10,0 II II II VIH VIH VIH VIL VIL VIL VOH VOH VOH VOL VOL VOL -IOH -IOH -IOH IOL IOL IOL 0,6 0,85 1,0 0,65 1,0 1,3 5,95 8,15 9,95 0,05 0,05 0,05 0,5 0,7 0,85 0,5 0,8 1,0 4,2 5,8 7,0 1,8 2,4 3,0 5,95 8,15 9,95 0,05 0,05 0,05 0,35 0,45 0,6 0,4 0,6 0,8 2,4 300 300 300 4,2 5,8 7,0 1,8 2,4 3,0 5,95 8,15 9,95 0,05 0,05 0,05 3,0 300 300 300 4,2 5,8 7,0 1,8 1000 1000 1000 8,2 IDD 2,0 2,0 2,0 10,0 IDD SYMBOL -40 MIN. MAX. 1200 MIN. +25 TYP. MAX. 1200 MIN. +85 MAX. 1200 VDD VI II Tstg Tamb -0,5 to + 15 max. 10
PCF1303T
V mA C C
-0,5 to VDD + 0,5 V -25 to + 125 -40 to + 85
UNIT A mA nA nA nA V V V V V V V V V V V V mA mA mA mA mA mA
NOTES
1 2 3
4
4
5
6
November 1986
5
Philips Semiconductors
Product specification
18-element bar graph LCD driver
PCF1303T
Tamb (C) PARAMETER VDD V Input voltage control input Vc Input voltage Vref max input Input voltage Vref min input Vref max - Vref min DC component bar output to back-plane output Back-plane frequency Input offset voltage Step voltage variation Input voltage slew rate Vc input 6,0 8,2 10,0 SR SR SR 50 50 50 50 50 50 50 50 50 V/s V/s V/s 11 8,2 Vstep 50 50 50 mV 10 8,2 VIO 120 120 120 mV 9 8,2 fBP 90 110 100 90 110 Hz 8 6,0 8,2 10,0 6,0 8,2 10,0 6,0 8,2 10,0 6,0 8,2 10,0 8,2 VIC VIC VIC VIR max VIR max VIR max VIR min VIR min VIR min VI VI VI VBP SYMBOL -40 MIN. 0,0 0,0 0,0 3,6 3,6 3,6 0,5 0,5 0,5 3,0 3,0 3,0 25 MAX. 6,0 8,2 10,0 5,5 7,7 9,5 1,0 4,5 6,0 MIN. 0,0 0,0 0,0 3,6 3,6 3,6 0,5 0,5 0,5 3,0 3,0 3,0 10 25 +25 TYP. MAX. 6,0 8,2 10,0 5,5 7,7 9,5 1,0 4,5 6,0 MIN. 0,0 0,0 0,0 3,6 3,6 3,6 0,5 0,5 0,5 3,0 3,0 3,0 25 +85 MAX. 6,0 8,2 10,0 5,5 7,7 9,5 1,0 4,5 6,0 V V V V V V V V V V V V mV 7 UNIT NOTES
November 1986
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Philips Semiconductors
Product specification
18-element bar graph LCD driver
Notes to D.C. characteristics 1. Vref min = 0,5 V, Vref max = 9,5 V, Vc = Vosc = 0 V, I1 at VSS or VDD. 2. See Fig.2. 3. Pin under test at VSS or VDD. All other inputs simultaneously at VSS or VDD. 4. IO = 0, all inputs at VSS or VDD. 5. VOH = VDD - 0,5 V, all inputs at VSS or VDD. 6. VOL = 0,4 V, all inputs at VSS or VDD. 7. fBP = 100 Hz, load segment outputs to back-plane output. C1 - C18 0,01 F, CBP = C1 + C2 + . . . C18 0,05 F, R1 - R18 2 M. 8. Rosc = 0,1 M, Cosc = 390 pF. 9. Number of segments 2 or 18. For n = 2: ( V ref max ) - ( V ref min ) V IO = V c - V ref min - ------------------------------------------------------------------- V H 18 For n = 18: ( V ref max ) - ( V ref min ) V IO = V c - V ref max + --------------------------------------------------------- V H 18 10. See equation (1). 11. Condition applies with clock oscillator such that fBP = 100 Hz.
PCF1303T
Fig.3 Typical application.
November 1986
7
Philips Semiconductors
Product specification
18-element bar graph LCD driver
PACKAGE OUTLINE SO28: plastic small outline package; 28 leads; body width 7.5 mm
PCF1303T
SOT136-1
D
E
A X
c y HE vMA
Z 28 15
Q A2 A1 pin 1 index Lp L 1 e bp 14 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 18.1 17.7 0.71 0.69 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT136-1 REFERENCES IEC 075E06 JEDEC MS-013AE EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
November 1986
8
Philips Semiconductors
Product specification
18-element bar graph LCD driver
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering
PCF1303T
Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
November 1986
9
Philips Semiconductors
Product specification
18-element bar graph LCD driver
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
PCF1303T
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
November 1986
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